Printed circuit board and electronic device

ABSTRACT

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤LOA/LiA≤50.309 is satisfied, where LiA represents a length of the first land in the longitudinal direction, and LOA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤LOB/LiB≤0.309 is satisfied, where LiB represents a length of the second land in the longitudinal direction, and LOB represents a thickness of solder on an end surface of the second electrode.

This application is a divisional of U.S. application Ser. No.16/821,550, filed Mar. 17, 2020, the contents of which is incorporatedby reference herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a mounting technology of electroniccomponents.

Description of the Related Art

As electronic devices such as digital still cameras and digital videocameras are required to be downsized, printed wiring boards used in theelectronic devices are also required to be downsized. A printed wiringboard has a plurality of electronic components mounted thereon. Thus,small-sized electronic components are used for downsizing the printedwiring board. The electronic components are chip components, such ascapacitors, inductors, and resistors, with two terminals. Each of theelectronic components has two electrodes disposed at two end portions inthe longitudinal direction. Each electrode is bonded to a land of theprinted wiring board via solder.

For downsizing the printed wiring board, it is also necessary that adistance between two electronic components (of the plurality ofelectronic components) adjacent to each other in the longitudinaldirection is reduced. In this case, short-circuit between the twoadjacent electronic components via solder must be avoided when theplurality of electronic components is mounted on the printed wiringboard at high density.

Japanese Patent Application Publication No. H7-74450 describes atechnique in which chip components are mounted on a board at highdensity. In addition, Japanese Patent Application Publication No.H7-74450 describes a technique in which a spacer is disposed between thechip component and the board for preventing sinking of the chipcomponent. With this technique, the amount of projection of the solderon the side surface of the chip component can be reduced.

By the way, electronic components are downsized compared to conventionalones, and expected to be further downsized in the future. Thus, as theelectronic components are further downsized, the spacer is also requiredto be downsized in the case where the spacer is disposed between theelectronic component and the board as described in Japanese PatentApplication Publication No. H7-74450. However, it is becoming difficultthat the spacer is downsized in accordance with the downsizing of theelectronic component. In addition, even if the spacer could bedownsized, it would be difficult that the downsized spacer is positionedbetween the electronic component and the board with high accuracy.

SUMMARY OF THE INVENTION

According to a first aspect of the present invention, a printed circuitboard includes a first chip component, a second chip component, and aprinted wiring board. The first chip component and the second chipcomponent each has a length L2 in the longitudinal direction and alength L3 in a lateral direction. The first chip component includes afirst electrode and a second electrode disposed at end portions in alongitudinal direction. The second chip component includes a thirdelectrode and a fourth electrode disposed at end portions in alongitudinal direction. The printed wiring board includes an insulatingsubstrate, a solder resist film disposed on the insulating substrate andcomprising a first opening and a second opening, a first land disposedin the first opening and bonded to the first electrode via solder, asecond land disposed in the first opening and bonded to the secondelectrode via solder, a third land disposed in the second opening andbonded to the third electrode via solder, and a fourth land disposed inthe second opening and bonded to the fourth electrode via solder. Thefirst chip component is an inductor or a capacitor, and the second chipcomponent is an inductor or a capacitor. The first chip component andthe second chip component are disposed adjacent to each other along thelongitudinal direction such that the longitudinal direction of the firstchip component is aligned with the longitudinal direction of the secondchip component. A distance Rx between the first chip component and thesecond chip component in the longitudinal direction is equal to orsmaller than the length W. A relationship of 0.894≤L2/L1≤1.120 issatisfied, where L1 represents a length of the first opening in thelongitudinal direction. A relationship of 0.894≤L2/L4≤1.120 issatisfied, where length L4 represents a length of the second opening inthe longitudinal direction. A relationship of 0.183≤L_(OA)/L_(iA)≤0.309is satisfied, where L_(iA) represents a length of the first land in thelongitudinal direction, and L_(OA) represents a thickness of solder onan end surface of the first electrode. A relationship of0.183≤L_(OB)/L_(iB)≤0.309 is satisfied, where L_(iB) represents a lengthof the second land in the longitudinal direction, and L_(OB) representsa thickness of solder on an end surface of the second electrode. Arelationship of 0.183≤L_(OC)/L_(iC)0.309 is satisfied, where L_(iC)represents a length of the third land in the longitudinal direction, andL_(OC) represents a thickness of solder on an end surface of the thirdelectrode. A relationship of 0.183≤L_(OD)/L_(iD)≤0.309 is satisfied,where L_(iD) represents a length of the fourth land in the longitudinaldirection, and L_(OD) represents a thickness of solder on an end surfaceof the fourth electrode.

According to a second aspect of the present invention, a printed circuitboard includes a first chip component, a second chip component, and aprinted wiring board. The first chip component and the second chipcomponent each has a length L2 in the longitudinal direction and alength L3 in a lateral direction. The first chip component includes afirst electrode and a second electrode disposed at end portions in alongitudinal direction. The second chip component includes a thirdelectrode and a fourth electrode disposed at end portions in alongitudinal direction. The printed wiring board includes an insulatingsubstrate, a solder resist film disposed on the insulating substrate andcomprising a first opening and a second opening, a first land disposedin the first opening and bonded to the first electrode via solder, asecond land disposed in the first opening and bonded to the secondelectrode via solder, a third land disposed in the second opening andbonded to the third electrode via solder, and a fourth land disposed inthe second opening and bonded to the fourth electrode via solder. Eachof the first chip component and the second chip component is a resistor,and the first chip component and the second chip component are disposedadjacent to each other along the longitudinal direction such that thelongitudinal direction of the first chip component is aligned with thelongitudinal direction of the second chip component. A distance betweenthe first chip component and the second chip component in thelongitudinal direction is equal to or smaller than the length L3. Arelationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents alength of the first opening in the longitudinal direction. Arelationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4represents a length of the second opening in the longitudinal direction.A relationship of 0.177≤L_(OA)/L_(iA)≤0.309 is satisfied, where L_(iA)represents a length of the first land in the longitudinal direction, andL_(OA) represents a thickness of solder on an end surface of the firstelectrode. A relationship of 0.177≤L_(OB)/L_(iB)≤0.309 is satisfied,where L_(iB) represents a length of the second land in the longitudinaldirection, and L_(OB) represents a thickness of solder on an end surfaceof the second electrode. A relationship of 0.177≤L_(OC)/L_(iC)≤0.309 issatisfied, where L_(iC) represents a length of the third land in thelongitudinal direction, and L_(OC) represents a thickness of solder onan end surface of the third electrode. A relationship of0.177≤L_(OD)/L_(iD)≤0.309 is satisfied, where L_(iD) represents a lengthof the fourth land in the longitudinal direction, and L_(OD) representsa thickness of solder on an end surface of the fourth electrode.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating an electronic device of a firstembodiment.

FIG. 2A is a schematic diagram of a bonding structure between electroniccomponents and a printed wiring board of the first embodiment.

FIG. 2B is a perspective view of an electronic component and one portionof the printed wiring board of the first embodiment.

FIG. 3A is a plan view of one portion of the printed wiring board of thefirst embodiment.

FIG. 3B is a plan view of one portion of a printed circuit board of thefirst embodiment.

FIG. 4 is a graph illustrating a simulation result obtained in the firstembodiment.

FIG. 5 is a perspective view of an electronic component and one portionof a printed wiring board of a second embodiment.

FIG. 6 is a graph illustrating a simulation result obtained in thesecond embodiment.

FIG. 7 is a schematic diagram of a bonding structure between anelectronic component and a printed wiring board of a third embodiment.

FIG. 8 is a graph illustrating a simulation result obtained in the thirdembodiment.

FIG. 9 is a plan view of one portion of a printed circuit board which isof the first embodiment and which includes three electronic components.

DESCRIPTION OF THE EMBODIMENTS First Embodiment

Hereinafter, some embodiments of the present invention will be describedwith reference to the accompanying drawings. FIG. 1 is a diagramillustrating a digital camera 600 that is an image pickup device as oneexample of electronic devices of a first embodiment. The digital camera600 is a digital camera with interchangeable lenses, and includes acamera body 601. A lens barrel 602 that includes lenses 621 isdetachably attached to the camera body 601. The camera body 601 includesa housing 611, a sensor module 700, an image processing module (notillustrated), and a wireless communication module 100 that is a printedcircuit board. The wireless communication module 100 is one example ofelectronic modules. The wireless communication module 100, the sensormodule 700, and the image processing module (not illustrated) aredisposed in the housing 611.

The sensor module 700 includes an image sensor 701, and a printed wiringboard 702 on which the image sensor 701 is mounted. The image sensor 701may be a complementary metal oxide semiconductor (CMOS) image sensor ora charge coupled device (CCD) image sensor. The image sensor 701 has afunction that converts the light incident through the lens barrel 602,to an electrical signal. The image processing unit includes an imageprocessing device. The image processing device may be a digital signalprocessor. The image processing device has a function that receives theelectrical signal from the image sensor 701, corrects the electricalsignal, and creates image data from the corrected electrical signal.

The wireless communication module 100 performs wireless communication ina GHz band, for example. The wireless communication module 100preferably has a transmission function. In the present embodiment, thewireless communication module 100 has a transmission function and areception function. The wireless communication module 100 includes aprinted wiring board 5 that includes an antenna 33, and a wirelesscommunication IC 31 that is mounted on the printed wiring board 5 andthat is one example of semiconductor components. In addition, thewireless communication module 100 includes a connector 32 that ismounted on the printed wiring board 5 and electrically connected to thewireless communication IC 31 via wires of the printed wiring board 5.The wireless communication IC 31 communicates wirelessly with anexternal device, such as a PC, a smartphone, or a wireless router, viathe antenna 33; and thereby sends or receives image data. Specifically,the wireless communication IC 31 modulates a digital signal thatrepresents image data, and transmits the modulated signal from theantenna 33, as a radio wave having a communication frequency thatconforms to radio standards. In addition, the wireless communication IC31 demodulates a radio wave received by the antenna 33, to a digitalsignal that represents image data. A shield case 34 is disposed betweenthe housing 611 and the wireless communication module 100 so as to facesemiconductor components and electronic components mounted on theprinted wiring board 5.

The wireless communication module 100 also includes electroniccomponents 1A, 1B, and 1C, which are mounted on the printed wiring board5. Each of the electronic components is a chip component with twoterminals Preferably, each of the electronic components has a size equalto or smaller than the 0603 size. For example, the size of eachcomponent may be the 0603 size that is 0.6×0.3 mm in a plan view, the0402 size that is 0.4×0.2 mm in a plan view, or the 0201 size that is0.25×0.125 mm in a plan view. More preferably, the size of eachcomponent is equal to or smaller than the 0402 size for downsizing theelectronic components. Note that the notation of the 0603 size, the 0402size, the 0201 size, and the like conforms to the size notation (inmillimeters) of electronic components defined in Japanese IndustrialStandards.

FIG. 2A is a schematic diagram of a bonding structure between theelectronic components, 1A and 1B, and the printed wiring board 5 of thefirst embodiment. FIG. 2B is a perspective view of the electroniccomponent 1A and one portion of the printed wiring board 5 of the firstembodiment. For convenience of description, FIG. 2B illustrates a statebefore the electronic component 1A is mounted on the printed wiringboard 5. Although FIG. 2B illustrates only the electronic component 1A,the electronic components 1B and 1C are similarly disposed on theprinted wiring board 5.

As illustrated in FIGS. 2A and 2B, each of the electronic components 1Aand 1B includes a main body 2, an electrode 3, and an electrode 4. Theelectrode 3 is a first electrode disposed at a first end portion of themain body 2, and the electrode 4 is a second electrode disposed at asecond end portion of the main body 2. The first end portion is one ofthe two end portions of the main body 2 in a longitudinal direction X ofthe main body 2, and the second end portion is the other. The electroniccomponents 1A and 1B are disposed adjacent to each other along thelongitudinal direction such that the longitudinal direction of theelectronic component 1A is equal to the longitudinal direction of theelectronic component 1B.

The printed wiring board 5 includes an insulating substrate 10, aconductor pattern 70 that is a first conductor pattern, and a conductorpattern 80 that is a second conductor pattern. The conductor pattern 70and the conductor pattern 80 are disposed on a main surface 110 of theinsulating substrate 10. The conductor patterns 70 and 80 may be piecesof metal foil made of gold, silver, or copper. The conductor pattern 70and the conductor pattern 80 are disposed on the main surface 110,spaced from each other in the longitudinal direction X. For example, theconductor patterns 70 and 80 are formed by using a manufacturing method,such as a subtractive process, in which a sheet of copper foil islaminated on the main surface 110 of the insulating substrate 10, andthen unnecessary portions of the sheet is dissolved and removed with achemical agent for leaving necessary conductor patterns. In addition,the printed wiring board 5 includes a solder resist film 6 formed on themain surface 110 and made of solder resist.

FIG. 3A is a plan view of one portion of the printed wiring board 5 ofthe first embodiment. As illustrated in FIG. 3A, the solder resist film6 has an opening 61 formed so as to expose one portion of the conductorpattern 70 and one portion of the conductor pattern 80 to the outside.The one portion of the conductor pattern 70 exposed by the opening 61 isa land 7 that is a first land. The one portion of the conductor pattern80 exposed by the opening 61 is a land 8 that is a second land. The land7 and the land 8 are disposed, spaced from each other in thelongitudinal direction X. Thus, a portion 111 of the main surface 110 ofthe insulating substrate 10 formed between the land 7 and the land 8 isexposed to the outside by the opening 61.

An edge portion 71 of the conductor pattern 70 that faces the conductorpattern 80 in the longitudinal direction X is exposed to the outsidewithout covered by the solder resist film 6, and an edge portion 72 ofthe conductor pattern 70 opposite to the edge portion 71 is covered bythe solder resist film 6. With this arrangement, the conductor pattern70 can be prevented from peeling off from the main surface 110. Inaddition, an edge portion 81 of the conductor pattern 80 that faces theconductor pattern 70 in the longitudinal direction X is exposed to theoutside without covered by the solder resist film 6, and an edge portion82 of the conductor pattern 80 opposite to the edge portion 81 iscovered by the solder resist film 6. With this arrangement, theconductor pattern 80 can be prevented from peeling off from the mainsurface 110.

In the first embodiment, two edge portions 73 and 74 of the conductorpattern 70 in a lateral direction Y orthogonal to the longitudinaldirection X are covered by the solder resist film 6. With thisarrangement, the conductor pattern 70 can be more effectively preventedfrom peeling off from the main surface 110. Similarly, two edge portions83 and 84 of the conductor pattern 80 in the lateral direction Y arecovered by the solder resist film 6. With this arrangement, theconductor pattern 80 can be more effectively prevented from peeling offfrom the main surface 110. As illustrated in FIG. 2A, the electrode 3and the land 7 are bonded to each other via a bonding portion 9 thatcontains solder. Similarly, the electrode 4 and the land 8 are bonded toeach other via the bonding portion 9 that contains solder.

The thickness of the solder resist film 6 is not limited to a specificvalue. For example, the thickness of the solder resist film 6 is equalto or larger than 10 μm and equal to or smaller than 35 μm. In addition,it is preferable that the top surface of the solder resist film 6 ishigher in position than the top surface of the lands 7 and 8 by 5 μm ormore. This is because when the solder resist exists at a position higherthan the top surface of the lands 7 and 8, the sinking of the electroniccomponent can be suppressed by a so-called lift-up effect, and thesolder can be sufficiently accommodated in a space between each land andthe electronic component. If the solder is sufficiently accommodated ina concave portion of the opening 61 of the solder resist film 6, thelength of projection of the solder that projects from an end surface ofeach electrode can be reduced.

In the first embodiment, the electronic components 1A, 1B, and 1C arechip components, each of which is an inductor or a capacitor. Asillustrated in FIG. 2B, the electrode 3 includes an end surface 11, andside surfaces 13 and 14. The end surface 11 is located at an outermostposition in the longitudinal direction X and orthogonal to thelongitudinal direction X, and the side surfaces 13 and 14 are located atan outermost position in the lateral direction Y and orthogonal to thelateral direction Y That is, the normal line to the end surface 11extends in the longitudinal direction X, and the normal line to the sidesurfaces 13 and 14 extends in the lateral direction Y In addition, theelectrode 3 includes a bottom surface 17 and a top surface 18. Each ofthe surfaces 11, 13, 14, 17, and 18 may be a flat surface or a curvedsurface. The electrode 4 includes an end surface 12, and side surfaces15 and 16. The end surface 12 is located at an outermost position in thelongitudinal direction X and orthogonal to the longitudinal direction X,and the side surfaces 15 and 16 are located at outermost positions inthe lateral direction Y and orthogonal to the lateral direction Y Thatis, the normal line to the end surface 12 extends in the longitudinaldirection X, and the normal line to the side surfaces 15 and 16 extendsin the lateral direction Y In addition, the electrode 4 includes abottom surface 19 and a top surface 20. Each of the surfaces 12, 15, 16,19, and 20 may be a flat surface or a curved surface. Thus, if theelectronic component is a chip component that is an inductor or acapacitor, each of the electrodes 3 and 4 has five surfaces to which thesolder adheres.

As illustrated in FIG. 1 , when a plurality of electronic components ismounted, closer to one another, on the printed wiring board 5 at highdensity, the distance between two adjacent electronic components isrequired to be reduced. By the way, for mounting each electroniccomponent 1(1A, 1B, or 1C) on the printed wiring board 5, the surfacemount technology (SMT) is used, which includes a printing process, amounting process, and a reflow process.

In the printing process, the screen printing that uses a mask is used.The mask is a thin metal plate made of stainless steel or the like andhaving holes. Via the mask, solder paste (not illustrated) that containssolder particles and flux is supplied to the lands 7 and 8 illustratedin FIG. 2B. In the mounting process, the electronic component 1A fed bya feeder or the like is sucked by a suction nozzle disposed at a head.After that, the electronic component 1A sucked by the suction nozzle ispositioned at a position above the lands 7 and 8 on which the solderpaste is disposed, and then the electronic component 1A is put on thesolder paste by lowering the suction nozzle.

In the reflow process, the solder paste is melted by heat for solderingthe electronic component 1 to the lands 7 and 8. During the reflowprocess, the melted solder creeps up on the end surface 11 of theelectrode 3 and the end surface 12 of the electrode 4 of the electroniccomponent 1. With this process, the bonding strength is secured.

However, if the melted solder excessively projects outward from the endsurface of each electrode, a short-circuit failure will occur betweentwo electronic components disposed closer to each other. As acountermeasure to this problem, a spacer might be able to be disposedunder the electronic component for preventing the sinking of theelectronic component and for controlling the amount of the solder thatprojects outward from the end surface of the electrode. However, sincethe electronic component is downsized, it is difficult to dispose asmall spacer on the printed wiring board.

As another countermeasure to the problem, the amount of the solder pastecould be reduced to the amount that does not cause the short-circuitfailure. Specifically, the holes of the mask used in the screen printingmight be able to be made smaller. However, if the holes of the mask aremade smaller, the solder paste will be easily left in the holes of themask, due to the viscosity of the solder paste. As a result, the solderpaste may be insufficiently supplied to the lands. Thus, adjusting theamount of solder paste is limited to some extent. By the way, on theprinted wiring board, not only small electronic components with sizesequal to or smaller than the 0402 size, but also large IC components andconnectors are mounted, and the large components are also required tohave sufficient bonding strength. In addition, in the screen printing, asingle mask is used for supplying the solder paste to the printed wiringboard at a time for bonding the electronic components, the ICcomponents, and the connectors to the printed wiring board. Thus, it isdifficult to use such a mask and perform the fine adjustment on theamount of solder paste for adapting the amount of solder paste to thesmall electronic components.

In the first embodiment, the length of the opening 61 of the solderresist film 6 in the longitudinal direction X is made nearly equal tothe length of the electronic components 1A, 1B, and 1C in thelongitudinal direction X. Specifically, the opening 61 is formed so asto satisfy the relationship of 0.894≤L₂/L₁≤1.120, where L₁ is a lengthof the opening 61 in the longitudinal direction X and L₂ is a length ofthe electronic component 1 in the longitudinal direction X. In addition,since the end surface 11 of the electrode 3 of the electronic components1A, 1B, and 1C and an edge portion of the land 7 located outside in thelongitudinal direction X are aligned with each other in a plan view, andthe end surface 12 of the electrode 4 and an edge portion of the land 8located outside in the longitudinal direction X are aligned with eachother in the plan view, the solder bonding portion 9 forms a filletlessstructure as illustrated in FIG. 2A.

If the size of the electronic components 1A, 1B, and 1C is the 0402size, the nominal value of the length L₂ of the electronic components1A, 1B, and 1C in the longitudinal direction X is 0.4 mm Thus, thereference value of the length L₁ of the opening 61 in the longitudinaldirection X is 0.4 mm, which is the same as the nominal value of theelectronic components 1A, 1B, and 1C. The tolerance of the referencevalue, 0.4 mm, of the length L₁ of the opening 61 in the longitudinaldirection X, that is, the manufacturing error is about ±0.025 mm in thepreviously-described subtractive process. In addition, the tolerance ofthe length L₂ of the electronic components 1A, 1B, and 1C in thelongitudinal direction X is about ±0.02 mm Thus, the lower limit ofL₂/L₁ is (0.4−0.02)/(0.4+0.025)=0.894. In addition, the upper limit ofL₂/L₁ is (0.4+0.02)/(0.4−0.025)=1.120. If L₂/L₁ is 1.00 or less, theabove-described lift-up effect is easily produced.

When the length L₁ of the opening 61 of the solder resist film 6 in thelongitudinal direction X is made nearly equal to the length L₂ of theelectronic components 1A, 1B, and 1C in the longitudinal direction X asdescribed above, the solder resist film 6 is located closer to theelectrodes 3 and 4. With this arrangement, when the melted solder wetsand spreads on the lands 7 and 8 in the reflow process, the meltedsolder does not wet and spread on a portion that is located outside theelectronic component in a plan view. That is, since the melted solderstays under the bottom surface of the electronic component, the meltedsolder causes its surface tension to lift the electronic component.Thus, the electronic components 1A, 1B, and 1C can be suppressed fromsinking toward the lands 7 and 8, and the melted solder can beaccommodated in a space between the electronic component 1A, 1B, or 1Cand the lands 7 and 8. In addition, since the opening 61 of the solderresist film 6 is disposed so as to be along with the outer shape of theelectronic component in a plan view of the printed wiring board 5, threesides of each of the lands 7 and 8 are surrounded with the solder resistfilm 6. Thus, while the electronic components 1A, 1B, and 1C can besuppressed from sinking toward the lands 7 and 8, the electroniccomponents can be further lifted, and the melted solder can beaccommodated more in the space between the electronic component 1A, 1B,or 1C and the lands 7 and 8. In this manner, even though the mask isused for supplying the solder paste to the printed wiring board 5 at atime, the solder can be suppressed from projecting outward in thelongitudinal direction X, from the end surface 11 of the electrode 3 andfrom the end surface 12 of the electrode 4. Therefore, the electroniccomponents 1A, 1B, and 1C can be mounted on the printed wiring board 5at high density while the bonding strength of the solder bonding portion9 is secured.

In the first embodiment, it is preferable that the composition of thesolder paste used for forming the solder bonding portion 9 isSn-3.0Ag-0.5Cu, that is, Ag is 3.0 percent by mass, Cu is 0.5 percent bymass, and Sn is the rest. In addition, the viscosity of the solder pasteis preferably in a range from 170 to 210 Pas (25° C.). In addition, theaverage particle diameter of the solder paste is preferably about 20 μm.The content of flux of the solder paste is preferably in a range from10.5 to 12.5 percent by mass.

In the first embodiment, as illustrated in FIG. 2A, the length L₂ of theelectronic component 1 in the longitudinal direction X is equal to orsmaller than the length L₁ of the opening 61 in the longitudinaldirection X, and the relationship of 0.894≤L₂/L₁≤1 is satisfied. Inaddition, the width of the opening 61 in the lateral direction Y isequal to the width of the electronic components 1A, 1B, and 1C in thelateral direction Y.

FIG. 3B is a plan view of one portion of the wireless communicationmodule 100, which is one example of printed circuit boards of the firstembodiment. FIG. 3B illustrates two electronic components 1A and 1B (ofa plurality of electronic components) adjacent to each other in thelongitudinal direction X of the electronic components 1A and 1B. The twoelectronic components, 1A and 1B, illustrated in FIG. 3B have the samesize, each allowing variations within the tolerance. In a plan view ofthe printed wiring board 5, a shortest distance Rx between the endsurface 11 of an electrode of one of the two electronic components andthe end surface 12 of an electrode of the other in the longitudinaldirection X is equal to or smaller than a width W of the main body 2 ofthe electronic component in the lateral direction Y (the end surface 11and the end surface 12 are disposed, facing each other). That is, thetwo electronic components 1A and 1B are mounted on the printed wiringboard 5 at high density, disposed adjacent to each other along thelongitudinal direction X of the electronic components 1A and 1B.

Since each of the electronic components 1A and 1B is a chip componentthat is an inductor or a capacitor, the area of each of the end surfaces11 and 12 is larger than the area of side surfaces 13, 14, 15, and 16,the area of bottom surfaces 17 and 19, and the area of the top surfaces18 and 20. Thus, when the solder paste is melted, the melted solderadheres to the end surfaces 11 and 12 of the electronic components 1Aand 1B, more than the side surfaces 13, 14, 15, and 16. That is, itwould be difficult to dispose electronic components at high density inthe longitudinal direction X (such that the distance between theelectronic components is reduced), unlike in the lateral direction Y ofthe main body 2 illustrated in FIG. 3B.

Thus, in the first embodiment, the length of projection of the solderthat projects from each of the end surfaces 11 and 12 in thelongitudinal direction X is controlled by adjusting the shape of each ofthe lands 7 and 8 with respect to the area of each of the end surfaces11 and 12.

In FIG. 2A, the length of projection of the solder that projects outwardin the longitudinal direction X from the end surface 11 of theelectronic component 1A is denoted by L_(OA), and the length of the land7 that extends inward in the longitudinal direction X from the endsurface 11 of the electronic component 1A, that is, the length of theland 7 in the longitudinal direction X that is exposed to the outsidewithout covered with the solder resist, is denoted by L_(iA). Similarly,the length of projection of the solder that projects outward in thelongitudinal direction X from the end surface 12 of the electroniccomponent 1A is denoted by L_(OB), and the length of the land 8 thatextends inward in the longitudinal direction X from the end surface 12of the electronic component 1A, that is, the length of the land 8 in thelongitudinal direction X that is exposed to the outside without coveredwith the solder resist, is denoted by L_(iB). In this bonding structure,the length of projection of the solder can be effectively reduced whenthe following relationship is satisfied.0.183≤L _(OA) /L _(iA)≤0.3090.183≤L _(OB) /L _(iB)≤0.309

This relationship is derived from the following simulation result.

The electronic component 1A is an inductor or a capacitor with the 0402size. That is, an area S_(DA) of the end surface 11 of the electrode 3and an area S_(DB) of the end surface 12 of the electrode 4 are each0.04 mm², which is smaller than 0.05 mm². The material of the insulatingsubstrate 10 is the flame-retardant type 4 (FR-4). The size of theopening 61 of the solder resist film 6 is 0.4×0.2 mm, in a plan view ofthe printed wiring board 5, so that the outer shape of the electroniccomponent is surrounded by the opening 61.

Under these conditions, the relationship between an area S_(LA) of theland 7 and the length (maximum value) of projection of the solder thatprojects from the end surface 11 of the electrode 3 in the longitudinaldirection X, and the relationship between an area S_(LB) of the land 8and the length (maximum value) of projection of the solder that projectsfrom the end surface 12 of the electrode 4 in the longitudinal directionX were simulated by using a computer.

In the simulation, the width of each of the lands 7 and 8 in the lateraldirection Y was set at a constant value of 0.2 mm, and the length ofeach of the lands 7 and 8 in the longitudinal direction X was changed ina range from 0.1 to 0.2 mm. The analysis was performed through thermalfluid simulation, with the length of each of the lands 7 and 8 in thelongitudinal direction X being changed. In the simulation, when thechange in shape of the solder stopped, the shape of the solder wasdetermined as a bonding shape, and the lengths of projections of thesolder that project from the end surfaces 11 and 12 were calculated. Thevolume of the melted solder on each of the lands 7 and 8 was set at aconstant value of 1 million μm³, and the distance between the topsurface of the land 7 and the bottom surface 17 of the electrode 3, andbetween the top surface of the land 8 and the bottom surface 19 of theelectrode 4 was set at a constant value of 20 μm.

FIG. 4 is a graph illustrating a simulation result obtained in the firstembodiment. FIG. 4 illustrates a calculation result on the length ofprojection of the solder with respect to S_(LA)/S_(DA). Note that sincethe length of projection of the solder that projects from the endsurface 12 is the same as that of the solder that projects from the endsurface 11, the description will be made for the length of projection ofthe solder that projects from the end surface 11.

It can be seen from FIG. 4 that when S_(LA)/S_(DA)<0.6, the length ofprojection of the solder that projects from the end surface 11 hardlychanges. That is, the length of projection of the solder is not reduced.In contrast, it can be seen that when S_(LA)/S_(DA) is equal to orlarger than 0.66, the length of projection of the solder can be reducedby 10% or more, compared to the length obtained when S_(LA)/S_(DA)=0.5.Thus, it is preferable that S_(LA)/S_(DA) is equal to or larger than0.66. When S_(LA)/S_(DA) is 0.66, the length L_(iA) of the land 7 of theelectronic component 1A is 132.5 μm. The thermal fluid simulation wasperformed with the length L_(iA) of 132.5 μm, and the length ofprojection of the solder that projects outward in the longitudinaldirection X from the end surface 11 was calculated. As a result, thelength of projection of the solder is 41 μm Thus, if the electroniccomponent 1A is an inductor or a capacitor with the 0402 size, the upperlimit of L_(OA)/L_(iA) is 0.309 (=41/132.5).

The length of projection of the solder can be made smaller as the valueof S_(LA)/S_(DA) increases. However, if the width of the lands 7 and 8in the lateral direction Y is 0.2 mm, and the lands 7 and 8 are extendedin the longitudinal direction X, the lands 7 and 8 will contact eachother when the length of each of the lands 7 and 8 in the longitudinaldirection X is 0.2 mm. In this case, S_(LA)/S_(DA)=1.00, andS_(LB)/S_(DB)=1.00. Thus, the land 7 and the land 8 are separated fromeach other when S_(LA)/S_(DA)<1.00 and S_(LB)/S_(DB)<1.00.

In the subtractive process that is a common method of manufacturingprinted boards, if a distance between lands is too small, the lands willcontact each other and easily cause a short-circuit failure. Thedistance between the land 7 and the land 8 that hardly causes theshort-circuit failure is 0.05 mm or more. Thus, if the width of thelands 7 and 8 in the lateral direction Y is set at 0.2 mm, and thedistance between the land 7 and the land 8 is set at 0.05 mm, the lengthof each of the lands 7 and 8 in the longitudinal direction X is 0.175mm. The thermal fluid simulation was performed with the length L_(iA) of175 μm, and the length of projection of the solder that projects outwardin the longitudinal direction X from the end surface 11 was calculated.As a result, the length of projection of the solder is 32 μm. Thus, ifthe electronic component 1 is an inductor or a capacitor with the 0402size, the lower limit of L_(OA)/L_(iA) is 0.183 (=32/175). In this case,S_(LA)/S_(DA) is 0.88.

As described above, in the first embodiment, it is preferable that0.66≤S_(LA)/S_(DA) and 0.66≤S_(LB)/S_(DB). With these conditions, thelength of projection of the solder that projects from the end surfaces11 and 12 can be effectively reduced, and the short-circuit failure canbe effectively prevented.

In addition, for preventing the short-circuit failure, the length ofprojection of the solder that projects from the end surfaces 11 and 12is reduced. However, a certain amount of solder is necessary for the endsurfaces 11 and 12 for keeping the bonding strength. Thus, it ispreferable that S_(LA)/S_(DA)≤0.88 and S_(LB)/S_(DB)≤0.88.

In addition, it is preferable that the ratio of the area of the portion111 to the area of the opening 61 of the solder resist film 6,illustrated in FIG. 3A, is equal to or larger than 12.5% and equal to orsmaller than 34%. If the ratio is in the range, the length of projectionof the solder can be effectively reduced. The ratio is a percentageobtained by dividing the area of the portion 111 by the area of theopening 61 (the portion 111 is one portion of the insulating substrate10, and is positioned between the lands 7 and 8 and exposed). The value12.5% is a calculation result of (0.4×0.2−0.175×0.2×2)/(0.4×0.2). Thevalue 34% is a calculation result of (0.4×0.2−0.1325×0.2×2)/(0.4×0.2).

In the graph of FIG. 4 , the length of projection of the solder has aninflection point with respect to S_(LA)/S_(DA). This is probably becausethe shape of the projection of the solder approximates a circularconvex. In the first embodiment, since the solder bonding portion 9 hasthe filletless structure, the solder having adhered to the electrode 3forms a circular shape. Thus, the length of projection of the solder canbe regarded as one portion of the radius of the circle. If the area ofthe land 7 is increased, that is, if part of the circular shape ofsolder is moved toward the bottom surface of the electrode 3 and theamount of the part of the solder is equal to or larger than apredetermined amount, the radius of the circle of the solder increases.As the radius of the circle of the solder increases, the solder movesinward in the longitudinal direction X, in the portion outside the endsurface 11 of the electronic component 1. As a result, the length ofprojection of the solder that projects from the end surface 11 can bereduced.

Thus, if each of the electronic components 1A and 1B is a chip componentthat is a capacitor or an inductor with the 0402 size, and a distanceRx, illustrated in FIG. 3B, between two electronic components 1A and 1Badjacent to each other in the longitudinal direction X is 0.15 mm, theshortest distance D is calculated as 68 μm (=150−41×2), from theabove-described result.

In addition to the simulation, the two electronic components 1A and 1Bwere actually mounted on the printed wiring board 5, and the shortestdistance D was measured.

The distance Rx between the two electronic components 1A and 1B adjacentto each other in the longitudinal direction X was set at 0.15 mm Eachsize of the lands 7 and 8 was set at 0.1325×0.2 mm, and S_(LA)/S_(DA)was set at 0.66. Under these conditions, the shortest distance D wasmeasured.

Specifically, the solder was supplied as solder paste in the printingprocess, and melted by heating. Then a sample with a volume of meltedsolder of about 1 million μ³ was extracted, and the shortest distance Din the sample was measured. As a result, the shortest distance D was 59μm.

Thus, there is a difference between the simulation result and the actualmeasurement result. This can be caused by the tolerance of the outershape of the electronic components 1A and 1B, a difference in positionof the mounted electronic components 1A and 1B, and a difference inposition of the electronic components 1A and 1B caused by theself-alignment when the solder is melted.

For these reasons, it is understood that the actual shortest distance Dwas obtained, smaller than the calculated shortest distance D. However,even though the actual shortest distance D varied, there was no failurein bonding in the solder bonding portion 9. In addition, even when theelectronic components 1A and 1B were closely disposed in thelongitudinal direction X, spaced from each other by 0.15 mm, theshort-circuit failure did not occur.

As can be seen from the above-described simulation and the experimentalresult, the short-circuit failure and the failure in bonding can beprevented even when the distance Rx between the electronic components 1Aand 1B in the longitudinal direction X is 0.15 mm. In addition, it wasconfirmed that the electronic components can be mounted at high densityeven when the distance Rx in the longitudinal direction X is 0.15 mm orless. Therefore, in the present embodiment, small electronic components1A and 1B can be mounted at high density without disposing anyadditional members, such as spacers, between the electronic components1A and 1B and the printed wiring board 5.

Note that although the description has been made for the electroniccomponents 1A and 1B with the 0402 size, the present disclosure is notlimited to this. For example, the electronic components 1A and 1B mayhave another size, such as the 0201 size, smaller than the 0402 size.That is, the electronic components 1A and 1B that face each other can bemounted at high density such that the distance Rx between the electroniccomponents 1A and 1B in the longitudinal direction X of the main body 2of each of the electronic components 1A and 1B is equal to or smallerthan the width W of the main body 2 in the lateral direction Y.

In addition, as illustrated in FIG. 9 , since a length Lo of projectionof the solder that projects in the longitudinal direction X can bereduced, the length Lo of projection of the solder can be controlled soas to have a value equal to or smaller than a length Lo′ of projectionof the solder in the lateral direction Y.

Actually, even when the electronic components 1A, 1B, and 1C wereclosely mounted, spaced from each other by 0.15 mm in the longitudinaldirection X and by 0.15 mm in the lateral direction Y, the short-circuitfailure did not occur.

Thus, the electronic components 1A, 1B, and 1C can be mounted at highdensity by disposing the electronic components 1A, 1B, and 1C so as tosatisfy the relationship of Ry≥Rx, where Rx is a distance between theelectronic components 1A and 1B disposed close to each other in thelongitudinal direction X, and Ry is a distance between the electroniccomponents 1A and 1C disposed close to each other in the lateraldirection Y.

Second Embodiment

Next, a printed circuit board of a second embodiment will be described.FIG. 5 is a perspective view of an electronic component 1D and oneportion of the printed wiring board 5 of the second embodiment. Forconvenience of description, FIG. 5 illustrates a state before theelectronic component 1D is mounted on the printed wiring board 5.Although FIG. 5 illustrates only the single electronic component 1D forconvenience of description, the electronic component 1D and at least oneother electronic component similar to the electronic component 1D aredisposed adjacent to each other in the longitudinal direction X of theelectronic component 1D. In the second embodiment, a component identicalto a component of the first embodiment is given an identical symbol, andthe detailed description thereof will be omitted.

In the first embodiment, the description has been made for the casewhere the electronic component is a chip component that is an inductoror a capacitor. In the second embodiment, the description will be madefor a case where the electronic component 1D is a chip component that isa resistor. The resistor is the same as the capacitor and the inductorin size in a plan view, but is different from the capacitor and theinductor in length in the thickness direction and in electrodestructure.

The electronic component 1D includes a main body 2A, an electrode 3A,and an electrode 4A. The electrode 3A is a first electrode disposed at afirst end portion of the main body 2A, and the electrode 4A is a secondelectrode disposed at a second end portion of the main body 2A. Thefirst end portion is one of the two end portions of the main body 2A ina longitudinal direction X (that is a predetermined direction) of themain body 2A, and the second end portion is the other.

As described in the first embodiment, the printed wiring board 5includes the solder resist film 6 formed on the main surface 110 of theinsulating substrate 10. The solder resist film 6 has the opening 61that exposes the lands 7 and 8. In the second embodiment, as in thefirst embodiment, the length of the opening 61 of the solder resist film6 in the longitudinal direction X is made nearly equal to the length ofthe electronic components 1D in the longitudinal direction X. Inaddition, as in the first embodiment, the width of the opening 61 in thelateral direction Y is equal to the width of the electronic components1D in the lateral direction Y.

In the second embodiment, the electronic component 1D is a chipcomponent that is a resistor. The electrode 3A has an end surface 11A, abottom surface 17A, and a top surface 18A. Each of the surfaces 11A,17A, and 18A may be a flat surface or a curved surface. The electrode 3Ahas no side surfaces described in the first embodiment, and located atoutermost positions in the lateral direction Y and orthogonal to thelateral direction Y. The end surface 11A is located at an outermostposition in the longitudinal direction X and orthogonal to thelongitudinal direction X. That is, the normal line to the end surface11A extends in the longitudinal direction X. The electrode 4A has an endsurface 12A, a bottom surface 19A, and a top surface 20A. Each of thesurfaces 12A, 19A, and 20A may be a flat surface or a curved surface.The electrode 4A has no side surfaces described in the first embodiment,and located at outermost positions in the lateral direction Y andorthogonal to the lateral direction Y. The end surface 12A is located atan outermost position in the longitudinal direction X and orthogonal tothe longitudinal direction X. That is, the normal line to the endsurface 12A extends in the longitudinal direction X. Thus, if theelectronic component 1D is a chip component that is a resistor, each ofthe electrodes 3A and 4A has three surfaces to which the solder adheres.Thus, more solder adheres to the end surfaces 11A and 12A.

Thus, in the second embodiment, the length of projection of the solderthat projects from the end surfaces 11A and 12A in the longitudinaldirection X is controlled by adjusting the shape of the land 7 withrespect to the area of the end surface 11A, and by adjusting the shapeof the land 8 with respect to the area of the end surface 12A.

The length of projection of the solder that projects outward in thelongitudinal direction X from the end surface 11A of the electroniccomponent 1D is denoted by L_(OA), and the length of the land 7 thatextends inward in the longitudinal direction X from the end surface 11Aof the electrode 3A of the electronic component 1D is denoted by L_(iA).Similarly, the length of projection of the solder that projects outwardin the longitudinal direction X from the end surface 12A of theelectronic component 1D is denoted by L_(OB), and the length of the land8 that extends inward in the longitudinal direction X from the endsurface of the electrode 4A of the electronic component 1D is denoted byL_(iB). In this bonding structure, the length of projection of thesolder can be effectively reduced by satisfying the followingrelationship.0.177≤L _(OA) /L _(iA)≤0.3090.177≤L _(OB) /L _(iB)≤0.309

This relationship is derived from the following simulation result.

The electronic component 1D is a resistor with the 0402 size. An areaS_(DA) of the end surface 11A of the electrode 3A and an area S_(DB) ofthe end surface 12A of the electrode 4A are each 0.026 mm². That is, thearea S_(DA) of the end surface 11A and the area S_(DB) of the endsurface 12A are smaller than 0.05 mm². The material of the insulatingsubstrate 10 is FR-4. The size of the opening 61 of the solder resistfilm 6 is 0.4×0 2 mm, in a plan view of the printed wiring board 5, sothat the outer shape of the electronic component is surrounded by theopening 61.

Under these conditions, the relationship between the area S_(LA) of theland 7 and the length (maximum value) of projection of the solder thatprojects from the end surface 11A of the electrode 3A in thelongitudinal direction X, and the relationship between the area S_(LB)of the land 8 and the length (maximum value) of projection of the solderthat projects from the end surface 12A of the electrode 4A in thelongitudinal direction X were simulated by using a computer.

In the simulation, the width of the lands 7 and 8 in the lateraldirection Y was set at a constant value of 0.2 mm, and the length of thelands 7 and 8 in the longitudinal direction X was changed in a rangefrom 0.1 to 0.2 mm. The analysis was performed through the thermal fluidsimulation, with the length of the lands 7 and 8 in the longitudinaldirection X being changed. In the simulation, when the change in shapeof the solder stopped, the shape of the solder was determined as abonding shape, and the lengths of projections of the solder that projectfrom the end surfaces 11A and 12A were calculated. The volume of themelted solder on each of the lands 7 and 8 was set at a constant valueof 1 million μm³, and the distance between the top surface of the land 7and the bottom surface 17A of the electrode 3A, and between the topsurface of the land 8 and the bottom surface 19A of the electrode 4A wasset at a constant value of 20 μm.

FIG. 6 is a graph illustrating a simulation result obtained in thesecond embodiment.

FIG. 6 illustrates a calculation result on the length of projection ofthe solder with respect to S_(LA)/S_(DA). Note that since the length ofprojection of the solder that projects from the end surface 12A is thesame as that of the solder that projects from the end surface 11A, thedescription will be made for the length of projection of the solder thatprojects from the end surface 11A.

It can be seen from FIG. 6 that when S_(LA)/S_(DA)<0.92, the length ofprojection of the solder that projects from the end surface 11A hardlychanges. That is, the length of projection of the solder is not reduced.In contrast, it can be seen that when S_(LA)/S_(DA) is equal to orlarger than 1.02, the length of projection of the solder can be reducedby 10% or more, compared to the length obtained when S_(LA)/S_(DA)=0.76.Thus, it is preferable that S_(LA)/S_(DA) is equal to or larger than1.02. When S_(LA)/S_(DA) is 1.02, the length L_(A) of the land 7 of theelectronic component 1D is 132.5 μm. The thermal fluid simulation wasperformed with the length L_(iA) of 132.5 μm, and the length ofprojection of the solder that projects outward in the longitudinaldirection X from the end surface 11A was calculated. As a result, thelength of projection of the solder is 41 μm. Thus, if the electroniccomponent 1D is a resistor with the 0402 size, the upper limit ofL_(OA)/L_(iA) is 0.309 (=41/132.5).

The length of projection of the solder can be made smaller as the valueof S_(LA)/S_(DA) increases. However, if the width of the lands 7 and 8in the lateral direction Y is 0.2 mm, and the lands 7 and 8 are extendedin the longitudinal direction X, the lands 7 and 8 will contact eachother when the length of each of the lands 7 and 8 in the longitudinaldirection X is 0.2 mm. In this case, S_(LA)/S_(DA)=1.54, andS_(LB)/S_(DB)=1.54. Thus, the land 7 and the land 8 are separated fromeach other when S_(LA)/S_(DA)<1.54 and S_(LB)/S_(DB)<1.54.

In the subtractive process that is a common method of manufacturingprinted boards, if a distance between lands is too small, the lands willcontact each other and easily cause a short-circuit failure. Thedistance between the land 7 and the land 8 that hardly causes theshort-circuit failure is 0.05 mm or more. Thus, if the width of thelands 7 and 8 in the lateral direction Y is set at a value of 0.2 mm,and the distance between the land 7 and the land 8 is set at a value of0.05 mm, the length of each of the lands 7 and 8 in the longitudinaldirection X is 0.175 mm. The thermal fluid simulation was performed withthe length L_(iA) of 175 and the length of projection of the solder thatprojects outward in the longitudinal direction X from the end surface11A was calculated. As a result, the length of projection of the solderis 31 μm. Thus, if the electronic component 1D is a resistor with the0402 size, the lower limit of L_(OA)/L_(iA) is 0.177 (=31/175). In thiscase, S_(LA)/S_(DA) is 1.35.

As described above, in the second embodiment, it is preferable that1.02≤S_(LA)/S_(DA) and 1.02≤S_(LB)/S_(DB). With these conditions, thelength of projection of the solder that projects from the end surfaces11A and 12A can be effectively reduced, and the short-circuit failurecan be effectively prevented.

In addition, for preventing the short-circuit failure, the length ofprojection of the solder that projects from the end surfaces 11A and 12Ais reduced. However, a certain amount of solder is necessary for the endsurfaces 11A and 12A for keeping the bonding strength. Thus, it ispreferable that S_(LA)/S_(DA)≤1.35 and S_(LB)/S_(DB)≤1.35.

Thus, if each of the electronic components 1D is a chip component thatis a resistor with the 0402 size, and a distance Rx between twoelectronic components 1D adjacent to each other in the longitudinaldirection X is 0.15 mm, the shortest distance D is calculated as 68 μm(=150−41×2), from the above-described result.

As can be seen from the above-described simulation and the experimentalresult, the short-circuit failure and the failure in bonding can beprevented even when the distance Rx between two electronic components 1Din the longitudinal direction X is 0.15 mm. In addition, it wasconfirmed that the electronic components can be mounted at high densityeven when the distance Rx in the longitudinal direction X is 0.15 mm orless. Therefore, in the present embodiment, small electronic components1D can be mounted at high density without disposing any additionalmembers, such as spacers, between the electronic components 1D and theprinted wiring board 5.

Note that although the description has been made for the electroniccomponent 1D with the 0402 size, the present disclosure is not limitedto this. For example, the electronic component 1D may have another size,such as the 0201 size, smaller than the 0402 size. That is, twoelectronic components 1D that face each other can be mounted at highdensity such that the distance Rx between the electronic components 1Din the longitudinal direction X of the main body 2 of each of theelectronic components 1D is equal to or smaller than the width W of themain body 2 in the lateral direction Y.

Third Embodiment

Next, a printed circuit board of a third embodiment will be described.FIG. 7 is a schematic diagram of a bonding structure between anelectronic component and a printed wiring board of a wirelesscommunication module. The wireless communication module is one exampleof printed circuit boards of the third embodiment. In the thirdembodiment, a component identical to a component of the first and thesecond embodiments is given an identical symbol, and the detaileddescription thereof will be omitted.

In the first embodiment, the description has been made for the casewhere the length L₂ of the electronic components 1A, 1B, and 1C in thelongitudinal direction X is equal to or smaller than the length L₁ ofthe opening 61 in the longitudinal direction X, that is, 0.894≤L₂/L₁≤1.However, the present disclosure is not limited to this, and isapplicable as long as the relationship of 0.894≤L₂/L₁≤1.120 issatisfied. In the third embodiment, the length L₂ of an electroniccomponent 1E in the longitudinal direction X is larger than the lengthL₁ of the opening 61 in the longitudinal direction X, that is,1<L₂/L₁≤1.120.

The thickness of the solder resist film 6 is in a range from 10 to 35μm, for example. The electrode 3 of the electronic component 1E isbonded to the land 7, exposed by the opening 61 of the solder resistfilm 6, via the solder bonding portion 9. The electrode 4 of theelectronic component 1E is bonded to the land 8, exposed by the opening61 of the solder resist film 6, via the solder bonding portion 9. Thewidth of the opening 61 in the lateral direction Y is 0.2 mm, which isequal to the width of the electronic component 1E in the lateraldirection Y. Thus, the opening 61 has a size that causes the electroniccomponent 1E to hide the opening 61 in a plan view. That is, in a planview of the printed wiring board 5, the whole of the opening 61 iscovered by the electronic component 1E.

In the third embodiment, the size of the opening 61 of the solder resistfilm 6 of the printed wiring board 5 is 0.36×0.2 mm such that theopening 61 is hidden by the electronic component 1E.

Under the above-described conditions and other conditions equal to thoseof the first embodiment, the analysis was performed through the thermalfluid simulation.

FIG. 8 is a graph illustrating a simulation result obtained in the thirdembodiment. FIG. 8 illustrates a simulation result on the length ofprojection of the solder that projects from the end surface 11 in thebonding structure of the first embodiment, and the simulation result onthe length of projection of the solder that projects from the endsurface 11 in the bonding structure of the third embodiment.Specifically, FIG. 8 illustrates the length of projection of the solderobtained when S_(LA)/S_(DA)=0.66 in both of the first and the thirdembodiments. As illustrated in FIG. 8 , the length of projection of thesolder in the first embodiment is 41.5 μm, and the length of projectionof the solder in the third embodiment is 33.5 μm.

It was confirmed from this result that the length of projection of thesolder is reduced more in the third embodiment than in the firstembodiment. Thus, in the third embodiment, small electronic components1E can be mounted at high density without disposing any additionalmembers, such as spacers, between the electronic components 1E and theprinted wiring board 5.

In the third embodiment, the end portions of the electronic component 1Ein the longitudinal direction X are located above the solder resist film6. Thus, during the reflow process, the melted solder is repelled by thesolder resist film 6; and some of the melted solder moves to the lands 7and 8, by a distance corresponding to the thickness of the solder resistfilm 6, in the thickness direction. As a result, the length ofprojection of the solder that adheres to the end surfaces 11 and 12 canbe further reduced. Thus, two electronic components 1E adjacent to eachother in the longitudinal direction X can be further closely disposed,spaced from each other by a distance equal to or smaller than the widthof the main body 2 in the lateral direction Y. Although the descriptionhas been made for the electronic component 1E in the third embodiment,similar effects can be produced even when the third embodiment isapplied to the electronic component 1A.

The present invention is not limited to the above-described embodiments,and can be modified within a technical spirit of the present invention.

In the above-described first to third embodiments, the description hasbeen made for the case where the lands 7 and 8 are rectangular. Thepresent disclosure, however, is not limited to this. For example, thelands 7 and 8 may have an elliptic shape or a convex shape. In addition,via-hole conductors may be disposed directly below the lands 7 and 8.With this structure, traces are easily drawn out when components are tobe mounted at high density.

In the above-described first to third embodiments, the description hasbeen made for the case where the width of the opening in the lateraldirection is equal to the width of the electronic component in thelateral direction. The present disclosure, however, is not limited tothis. For example, there may be a difference between the width of theopening in the lateral direction and the width of the electroniccomponent in the lateral direction, and the difference may be in a rangefrom −0.05 to +0.05 mm That is, the present disclosure is applicable aslong as the width of the opening in the lateral direction and the widthof the electronic component in the lateral direction are substantiallythe same as each other within a predetermined tolerance range.

In the above-described first to third embodiments, the description hasbeen made for the case where the edge portions 73, 74, 83, and 84 of theconductor patterns 70 and 80 in the lateral direction are covered withthe solder resist film. The present disclosure, however, is not limitedto this. The edge portions 73, 74, 83, and 84 of the conductor patterns70 and 80 may not be covered with the solder resist film. In this case,the width of the lands 7 and 8 in the lateral direction may be equal tothe width of the opening in the lateral direction, or may be smallerthan the width of the opening in the lateral direction.

Other Embodiments

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2019-059246, filed Mar. 26, 2019, and Japanese Patent Application No.2020-032327, filed Feb. 27, 2020, which are hereby incorporated byreference herein in their entirety.

What is claimed is:
 1. An electric module comprising: a first chipcomponent having a length L2 in a longitudinal direction and a length Win a lateral direction, the first chip component having a firstelectrode and a second electrode disposed at end portions in thelongitudinal direction; a second chip component having a third electrodeand a fourth electrode disposed at end portions in the longitudinaldirection; and a printed wiring board having an insulating substrate, asolder resist film disposed on the insulating substrate and has a firstopening and a second opening, a first conductor pattern disposed in thefirst opening and bonded to the first electrode via solder, a secondconductor pattern disposed in the first opening and bonded to the secondelectrode via solder, a third conductor pattern disposed in the secondopening and bonded to the third electrode via solder; and a fourthconductor pattern disposed in the second opening and bonded to thefourth electrode via solder, wherein the first conductor patternincludes a first region on which the solder resist film is provided anda second region on which the solder resist film is not provided, whereinthe second conductor pattern includes a third region on which the solderresist film is provided and a fourth region on which the solder resistfilm is not provided, wherein the first chip component is at least oneof an inductor, a capacitor and a resistor, wherein the first chipcomponent and the second chip component are disposed adjacent to eachother along the longitudinal direction such that the longitudinaldirection of the first chip component is aligned with the longitudinaldirection of the second chip component, wherein a distance Rx betweenthe first chip component and the second chip component in thelongitudinal direction is equal to or smaller than the length W, andwherein a relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1represents a length of the first opening in the longitudinal direction.2. The electric module according to claim 1, wherein the distance Rxbetween the first chip component and the second chip component is 0.15mm or less.
 3. The electric module according to claim 1, wherein an areaof each of the end surface of the first electrode and the end surface ofthe second electrode is less than 0.05 mm2.
 4. The electric moduleaccording to claim 1, wherein the first chip component with a size equalto or smaller than 0402 size.
 5. The electric module according to claim1, wherein in a plan view of the printed wiring board, an area where theinsulating substrate is exposed in the first opening is 12.5% or moreand 34% or less with respect to an area of the first opening.
 6. Theelectric module according to claim 1, wherein the length L2 of the firstchip component in the longitudinal direction is larger than both of thelength L1 of the first opening in the longitudinal direction.
 7. Theelectric module according to claim 1, wherein in a plan view of theprinted wiring board, a whole of the first opening is covered by thefirst chip component.
 8. The electric module according to claim 7,wherein the antenna and the wireless communication IC are provided on asurface of the insulating substrate on a side where the solder resistfilm is provided.
 9. The electric module according to claim 1, furthercomprising an antenna mounted on the printed wiring board and a wirelesscommunication IC mounted on the printed wiring board, wherein theelectric module is a wireless communication module.
 10. The electricmodule according to claim 1, wherein the first chip component is theresistor, wherein a relationship of 1.02≤SLA/SDA≤1.35 is satisfied,where SDA represents an area of the end surface of the first electrode,and SLA represents an area of the second region of the first conductorpattern, and wherein a relationship of 1.02≤SLB/SDB≤1.35 is satisfied,where SDB represents an area of the end surface of the second electrode,and SLB represents an area of the fourth region of the second conductorpattern.
 11. The electric module according to claim 10, wherein thesecond chip component is the resistor, wherein a relationship of0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length ofthe second opening in the longitudinal direction.
 12. The electricmodule according to claim 11, wherein the third conductor patternincludes a fifth region on which the solder resist film is provided anda sixth region on which the solder resist film is not provided, whereinthe fourth conductor pattern includes a seventh region on which thesolder resist film is provided and a eighth region on which the solderresist film is not provided, wherein a relationship of0.177≤LOC/LiC≤0.309 is satisfied, where LiC represents a length of thesixth region of the third conductor pattern in the longitudinaldirection, and LOC represents a thickness of solder on an end surface ofthe third electrode, and wherein a relationship of 0.177≤LOD/LiD≤0.309is satisfied, where LiD represents a length of the eighth region of thefourth conductor pattern in the longitudinal direction, and LODrepresents a thickness of solder on an end surface of the fourthelectrode.
 13. An electronic device comprising: a housing; and theelectric module according to claim 1 and disposed in the housing. 14.The electronic device according to claim 13, wherein a surface of theelectronic module on a side where the solder resist film is provided isarranged closer to the housing than a surface on a side where the solderresist film is not provided.
 15. The electronic device according toclaim 14, wherein the electronic device is a camera.
 16. The electricmodule according to claim 1, wherein a relationship of0.177≤LOA/LiA≤0.309 is satisfied, where LiA represents a length of thesecond region of the first conductor pattern in the longitudinaldirection, and LOA represents a thickness of solder on an end surface ofthe first electrode, and wherein a relationship of 0.177≤LOB/LiB≤0.309is satisfied, where LiB represents a length of the fourth region of thesecond conductor pattern in the longitudinal direction, and LOBrepresents a thickness of solder on an end surface of the secondelectrode.
 17. The electric module according to claim 16, wherein thefirst chip component is the inductor the a capacitor, wherein arelationship of 0.183≤LOA/LiA≤0.309 is satisfied, where LiA represents alength of the second region of the first conductor pattern in thelongitudinal direction, and LOA represents a thickness of solder on anend surface of the first electrode, and wherein a relationship of0.183≤LOB/LiB≤0.309 is satisfied, where LiB represents a length of thefourth region of the second conductor pattern in the longitudinaldirection, and LOB represents a thickness of solder on an end surface ofthe second electrode.
 18. The electric module according to claim 17,wherein a relationship of 0.66≤SLA/SDA≤0.88 is satisfied, where SDArepresents an area of the end surface of the first electrode, and SLArepresents an area of the second region of the first conductor pattern,and wherein a relationship of 0.66≤SLB/SDB≤0.88 is satisfied, where SDBrepresents an area of the end surface of the second electrode, and SLBrepresents an area of the fourth region of the second conductor pattern.19. The electric module according to claim 17, wherein the second chipcomponent is an inductor or a capacitor, wherein a relationship of0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length ofthe second opening in the longitudinal direction.
 20. The electricmodule according to claim 19, wherein the third conductor patternincludes a fifth region on which the solder resist film is provided anda sixth region on which the solder resist film is not provided, whereinthe fourth conductor pattern includes a seventh region on which thesolder resist film is provided and a eighth region on which the solderresist film is not provided, wherein a relationship of0.183≤LOC/LiC≤0.309 is satisfied, where LiC represents a length of thesixth region of the third conductor pattern in the longitudinaldirection, and LOC represents a thickness of solder on an end surface ofthe third electrode, and wherein a relationship of 0.183≤LOD/LiD≤0.309is satisfied, where LiD represents a length of the eighth region of thefourth conductor pattern in the longitudinal direction, and LODrepresents a thickness of solder on an end surface of the fourthelectrode.